Basic non-adhesive flexible copper-clad laminate
Category:
Product Advantages
Compared to traditional three-layer flexible copper-clad laminates with adhesive, the basic, adhesive-free flexible copper-clad laminate is lighter and thinner, and boasts superior flexibility, dimensional stability, electrical performance, thermal stability, and heat resistance. It demonstrates tremendous application potential in fields such as consumer electronics, automotive electronics, and telecommunications equipment.
Product Applications
FPC substrates, LCD/OLED display modules, camera modules, TP modules, COF, and more
Substrate parameters
| Project | Method | Specification value | |
| Physical properties | Thickness | Micrometer | 25 μm |
| Wide format | Tape measure measurement | 250~1250mm | |
| Dielectric strength | ASTM D149 | 336KV/mm | |
| Haze | ASTM D1003 | 7.3% | |
| Flammability | UL94 | VO | |
Product Parameters
| Project | Method | Specification value | |
| Physical properties | Thickness | Micrometer | 37 ± 3 μm |
| Wide format | Tape measure measurement | 250~1250mm | |
| Dyne value | Dyne pen | ≥#42 | |
| Adhesion | Peel strength test | 5N/cm | |
| Appearance performance | Defective spots (including raised or recessed spots/dirty spots), Smooth bumps and dents allowed |
Light table 20W × 4 FLFL lamps/microscope (500*500mm) |
0.12 < Φ ≤ 0.16 mm, ≤ 15 units |
| 0.16 < Φ ≤ 1.0 mm, ≤ 10 units | |||
| Φ > 1.0 mm, not allowed | |||
| Linear defects, scratches | W ≤ 0.01 mm, L ≤ 10 mm, not included | ||
| 0.02 mm ≥ W > 0.01 mm 15 mm ≥ L > 1.5 mm, ≤ 5 units |
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| 0.2 mm < W or 15 mm < L—not allowed | |||
| Pinhole collects data | 30 < Φ ≤ 60 µm, 100 units 60 < Φ ≤ 100 µm, 10 units Φ > 100 μm: Not allowed |
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| Indentation | Visual/Film Ruler | Gentle, OK. | |
Basic non-adhesive flexible copper-clad laminate
Category:
- Description
-
Product Advantages
Compared to traditional three-layer flexible copper-clad laminates with adhesive, the basic, adhesive-free flexible copper-clad laminate is lighter and thinner, and boasts superior flexibility, dimensional stability, electrical performance, thermal stability, and heat resistance. It demonstrates tremendous application potential in fields such as consumer electronics, automotive electronics, and telecommunications equipment.
Product Applications
FPC substrates, LCD/OLED display modules, camera modules, TP modules, COF, and more
Substrate parameters
Project Method Specification value Physical properties Thickness Micrometer 25 μm Wide format Tape measure measurement 250~1250mm Dielectric strength ASTM D149 336KV/mm Haze ASTM D1003 7.3% Flammability UL94 VO Product Parameters
Project Method Specification value Physical properties Thickness Micrometer 37 ± 3 μm Wide format Tape measure measurement 250~1250mm Dyne value Dyne pen ≥#42 Adhesion Peel strength test 5N/cm Appearance performance Defective spots (including raised or recessed spots/dirty spots),
Smooth bumps and dents allowedLight table 20W × 4 FLFL lamps/microscope
(500*500mm)0.12 < Φ ≤ 0.16 mm, ≤ 15 units 0.16 < Φ ≤ 1.0 mm, ≤ 10 units Φ > 1.0 mm, not allowed Linear defects, scratches W ≤ 0.01 mm, L ≤ 10 mm, not included 0.02 mm ≥ W > 0.01 mm
15 mm ≥ L > 1.5 mm, ≤ 5 units0.2 mm < W or 15 mm < L—not allowed Pinhole collects data 30 < Φ ≤ 60 µm, 100 units
60 < Φ ≤ 100 µm, 10 units
Φ > 100 μm: Not allowedIndentation Visual/Film Ruler Gentle, OK.
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